Embedded Boxed PC
SMARC-Modul with Intel Atom® x5/x7 E3900
Entirely of aluminium
Fanless Design
Heat dissipation plays a crucial role if the SMARC is to achieve the full performance. This fanless aluminum housing is perfect for absorbing and dissipating heat – so that the Intel Apollolake E39-series processor is guaranteed to work at maximum performance.
Thanks to a lot of dedicated I / O connections, the embedded Boxed Computer can be easily expanded with other wired peripheral devices.
Your logo could be on top of this beatiful enclosure. We are working with SOLIDWORKS®. It let us easily edit the design at any stage in the design process.
We included a heatspreader into the enclosure to make the whole design more functional. This helped to keep the case as low as possible.
- DisplayPort++
- 2x USB2.0
- microSD
- M.2 NVMe
- LAN (GbE)
- WLAN
- 150x106x19 mm
- 12 – 36 VDCmm
- 0 – 70 °C
This Project was realized with our Building Block
SMbd-E39
Multimedia
Industrial Internet of Things
Medical
Intel Atom E3900 Series for embedded computers in SMARC formfactor
industrial automation and control
infotainment
point of sales
Highlights
The Datakamp SMARC module is available with the latest generation of Intel® Atom ™, Pentium® and Celeron® processors (code name “Apollo Lake”). It impresses with a new level of computing power, security and
graphics and image processing combined with an extremely compact form factor. The module corresponds to the modern SGET standard SMARC 2.0 / 2.1 (“Smart Mobility ARChitecture”). The SMARC module is
particularly suitable for small, low-power applications with low costs. We take a strong focus on boot speed, security and flexibility, thats the reason we decided to use Open Source Coreboot. For OS boot we have implemented SeaBIOS and UEFI payload.
Three display outputs equipped with the latest Intel® graphics
processor core enable applications for an impressive user experience. Excellent 3D processing and improved video encoding as well as playback performance enable even better representation of high-resolution multimedia content. High-speed interfaces, e.g. Gigabit Ethernet, PCIe, USB 3.0 and 6Gbps SATA ensure a high-performance communication bandwidth. SPI, SDIO, CAN and serial interfaces extend the communication path to the carrier board. Integrated eMMC with up to 64 GB and the option of dual-channel LVDS, MIPI DSI or native eDP enable flexibility.
Details
- SMARC 2.0 Modul + Baseboard (SBC) with Intel Quad Core Atom® x5-E3940 Processor
- 2M Cache, up to 1.80 GHz
- Main memory 4 GB upto 8GB LPDDR4 SDRAM
- 24 Bit Dual Channel LVDS (Full HD), Displayport++(4K)
- 32 GB eMMC FLASH opt. upto 512 GB or pSLC
- 2 x Gigabit LAN, I211 10/100/1000 BASE-T
- 2 x USB 3.0 Ports
- 6 x USB 2.0 Ports
- SD-Card interface
- 2 x CAN interface
- 3 x Serial interface
- 1 x SATA interface
- I²S Audio interface
- 2x I²C
- PCIe
- Watchdog
- RTC
- ACPI Switch
PROCESSOR
Intel Atom x5-E3930 dual-core 1.3/1.8GHz, 6.5W
opt. up to Pentium N4200 quad core
MEMORY
4GB to 8GB LPDDR4 SDRAM
GRAPHICS
Intel Clear Video HD Technology, Intel Quick Sync
Video
VIDEO INTERFACE
24-Bit LVDS (Full HD), Displayport++ (4096×2160)
MASS STORAGE
32 GB eMMC und microSD Kartenslot
NETWORKING
M.2 WLAN/Bluetooth, GB LAN RJ45
USB
2 x USB 3.0 Typ A
PCI-E
A-D
AUDIO
I2S interface
SERIAL PORTS
3 x Serial interface
OTHER INTERFACES
ACPI Schalter
POWER SUPPLY
12V DC or 24 V DC-in
OPERATING SYSTEM
Support for Microsoft® Windows, Linux and other real-time OS
DIMENSIONS
82mm x 50mm
OPERATING TEMPERATURE
0°C to +60°C
FUNCTIONAL DIAGRAM
