Here we are providing you a choosen list out of projects we have made. Maybe you can identify yourself with it?
The steadily shrinking structures of microelectronics also increase the complexity of an PCB assembly. In this connection, the effort of testing raises considerably. To keep the quality up, it is necessary to guarantee, that all boards are testet in equal conditions.
To meet that requirement, we are developing semi automatic testers for embedded devices. This includes the development of hardware and software. Standard interfaces that need to be tested are: I2C, SPI, Ethernet, CAN, USB, GPIO and others.
When switching to semi-automatic testers, you benefit from time savings and consistent quality. In one case we were able to shorten the time for testing from two hour to two minutes.
In this case the device under test is a motor driver board. Two BLDC and two step motor outputs need to be tested. Additional to that a couple of interfaces need to be checked too. These are SPI, CAN and GPIOs.
A combination of host computer function test hardware and software makes it possible to semi automatically test an ARM-CPU board.
With additive manufacturing we are able to create customized mechanics and mountings in a time saving way and good precision.
For parts in modarate pecision and low temperatur stability we are using filament printers.
Really detailed parts or parts with a need for high temperatur stability will be manufacured with a resin printer.
Computer on Module
Q7bd-iMX6 with the Freescale® i.MX6 Cortex™- A9 processor in the Qseven form factor.
Very compact and highly integrated single board computer with Freescale® i.MX6 Cortex™ A9 processor. Embedded Qseven modul 70 x 70mm (2.75″ x 2.75″)
eN-GXSOC with the AMD® embedded G-Series in the embedded NUC™ form factor
Very compact and highly integrated single board computer with AMD® Embedded G-series SOC, Embedded NUC™ Type 2 “Connectivity” modul 101.6 x 101.6 (4” x 4”)
Computer on module with an Intel Atom x5-E3930 dual-core combined with a custumized baseboard to reach a very low formfactor.
The enclosure is 19mm high with outer dimensions of 150×106,5mm